Microstructure and performance of electroformed Cu/nano-SiC composite

The composite electroforming technology was propounded to fabricate nano-sized carbide silicon particles (nano-SiC) reinforced copper composite. The surface morphology, microstructure, microhardness, wear resistance and electrical resistivity (Er) were examined. The results showed that nano-SiC were embedded in copper matrix uniformly and tightly. Comparing with the pure copper deposit, the surface of the composite was more fine, more compact and smooth, and the composite exhibited higher microhardness and better wear resistance. Besides, the change range of Er was small.