Title of article
Prediction of crack depth during quenching test for an ultra high temperature ceramic
Author/Authors
Songhe Meng، نويسنده , , Guoqian Liu، نويسنده , , Shilong Sun، نويسنده ,
Issue Information
ماهنامه با شماره پیاپی سال 2010
Pages
4
From page
556
To page
559
Abstract
Quenching test was used to characterize thermal shock properties of ZrB2–20%SiCp–10%AlN. It showed that critical temperature difference was 400 °C, and residual strength was a constant while quenching temperature was higher than 400 °C. Inertial stress was investigated under different temperatures, as shown, a higher temperature led to a lower inertial stress. Crack resistance under room temperature was compared with that under 600 °C, as can be seen, a higher temperature led to a higher crack resistance. Dynamic thermal stress intensity factor was investigated at the quenching temperature of 600 °C, and it indicated that stress intensity factor ascended first and descended afterwards, farther crack propagation would not occur when Biot value is in a certain range, such as Biot = 5. Crack would not propagate when Biot = 1, and specimen would be destroyed when Biot = 10.
Journal title
Materials and Design
Serial Year
2010
Journal title
Materials and Design
Record number
1068632
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