• Title of article

    Parameters controlling the microstructure of Al–11Si–2.5Cu–Mg alloys

  • Author/Authors

    Z. Ma، نويسنده , , W. P. Lewis, A. E. Samuel، نويسنده , , A.M.A. Mohamed، نويسنده , , A.M. Samuel، نويسنده , , F.H. Samuel، نويسنده , , H.W. Doty، نويسنده ,

  • Issue Information
    ماهنامه با شماره پیاپی سال 2010
  • Pages
    11
  • From page
    902
  • To page
    912
  • Abstract
    This study investigated the effects of cooling rate during solidification, heat treatment, and the addition of Mn and Sr on the formation of intermetallic phases in Al–11Si–2.5Cu–Mg alloys. Microstructures were monitored using optical microscopy and EPMA techniques. The results reveal that the volume fractions of intermetallic phases are generally much lower in the furnace-cooled samples than in the air-cooled ones due to the dissolution of the β-AlFeSi and Al2Cu phases during slow cooling at critical dissolution temperatures. Strontium additions increased the volume fraction of the Al2Cu phase in the as-cast conditions at low and high cooling rates, as well as at varying ranges of Mn levels. Platelets of the β-AlFeSi phase were to be observed in the microstructure of the as-cast air-cooled samples with a DAS of 40 μm at both Mn levels, while none of these particles were to be found in the furnace-cooled samples with a DAS of 120 μm. Sludge particles were observed in almost all of the air-cooled alloys with sludge factors of between 1.4 and 1.9. These particles, however, were not observed in the furnace-cooled alloys with similar sludge factors. Solution heat treatment coarsens the Si particles in the non-modified alloys under both sets of cooling conditions studied. In the Sr-modified alloys, solution treatment has varied effects depending on the cooling rate and the level of Mn present.
  • Keywords
    Cooling rates , Cast Al–Si alloys , Heat treatment , Manganese addition , Modification , Intermetallics
  • Journal title
    Materials and Design
  • Serial Year
    2010
  • Journal title
    Materials and Design
  • Record number

    1068682