• Title of article

    Acid colloidal silica slurry for Cu CMP

  • Author/Authors

    Kim، Nam Hoon نويسنده , , Chang، Eui-Goo نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2004
  • Pages
    -25
  • From page
    26
  • To page
    0
  • Abstract
    Semi-abrasive free slurry for copper chemical mechanical planarisation (CMP) with below 0.5% acid colloidal silica provides good hydrogen peroxide stability, excellent colloidal silica dispersion ability and easiness of post-CMP cleaning. This approach may be useful for the application of singleand first-step copper CMP slurry with one package system.
  • Keywords
    Hydrograph
  • Journal title
    IEE Electronics Letters
  • Serial Year
    2004
  • Journal title
    IEE Electronics Letters
  • Record number

    106967

    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=10&DC=106967