Title of article :
Nickel-silicidation process using hydrogen implantation
Author/Authors :
C.-J.، Choi, نويسنده , , S.-A.، Song, نويسنده , , Y.-W.، Ok, نويسنده , , T.-Y.، Seong, نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2004
Pages :
-390
From page :
391
To page :
0
Abstract :
The effect of hydrogen implantation on a nickel silicide process has been investigated. X-ray photoemission spectroscopy results show that the hydrogen implantation is effective in suppressing the oxidation of NiSi. It is further shown that the junction leakage current of the implanted samples is about one order of magnitude lower than that of the unimplanted ones.
Keywords :
Hydrograph
Journal title :
IEE Electronics Letters
Serial Year :
2004
Journal title :
IEE Electronics Letters
Record number :
107204
Link To Document :
بازگشت