Microstructure and mechanical properties of Cu/SiC metal matrix composite fabricated via friction stir processing

In the present investigation, pure Cu sheets were reinforced with 25 μm SiC particles to fabricate a composite surface layer by friction stir processing (FSP). In order to improve distribution of reinforcing SiC particles, a net of holes were designed by drill on the surface of pure Cu sheet. For evaluation of microstructure, Optical Microscope (OM) and Scanning Electron Microscope (SEM) were used. Microstructural observation confirmed fine and equiaxed grains in the stir zone (SZ) and showed that SiC particles act as heterogeneous nucleation sites in the dynamic recrystallization of Cu grains. Moreover, agglomeration of particles was not observed and fine particles had a good distribution in SZ. In the SEM micrographs, porosities were detected as microstructure defects. Microhardness measurements showed that surface hardness was two times as high as that of substrate. The rotational wear tests demonstrated that use of SiC particles enhanced wear resistance and increased average friction coefficient of pure Cu. No intermetallic compound was found in Cu/SiC composite as revealed by XRD analysis.