Study on heat transfer performance for loop heat pipe with circular flat evaporator

A loop heat pipe (LHP) with a circular flat evaporator was designed for cooling electronic devices. The flat evaporator with an outside diameter of 41 mm and a thickness of 15 mm was developed with a copper powder wick. The developed evaporator was examined to improve insufficient subcooling of liquid in a compensation chamber, which decreases an operating limitation of the LHP. Many different orientations of the elevation and direction of the evaporator were also considered during all of the experiments for this system. The active heating area was 3 cm × 3 cm, and water was used in the tests. This LHP generated a heat load in excess of 140 W with a total thermal resistance of 0.39 °C/W.