Title of article :
Material design of a film cooling system using experimental heat transfer data
Author/Authors :
Kyung Min Kim، نويسنده , , Jiwoon Song، نويسنده , , Jun Su Park، نويسنده , , Sanghoon Lee، نويسنده , , Hyung Hee Cho، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2012
Abstract :
The present study numerically calculates the temperature and thermal stress distributions near a normal cooling hole. We evaluate the effects of material properties on thermal damage by using local heat transfer data from previous experiments. The experimental results are converted into the surface’s heat transfer coefficients and the adiabatic wall temperature while using surface boundary conditions. The calculated results reveal that the thermal stresses depend on the main stream temperature and the material properties. To predict the maximum thermal stress near the normal cooling hole, we provide a single correlation consisting of the material properties and the main stream temperature.
Keywords :
Film cooling , Material properties , Thermal stress , Finite elements
Journal title :
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Journal title :
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER