Title of article
Transient heat conduction analysis of a cracked half-plane using dual-phase-lag theory
Author/Authors
K.Q. Hu، نويسنده , , Z.T. Chen، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2013
Pages
7
From page
445
To page
451
Abstract
In this paper, the transient temperature field around a partially insulated crack in a half-plane is obtained by applying the dual-phase-lag heat conduction model. Fourier and Laplace transforms are applied and the heat conduction problem is reduced to solving a singular integral equation. The asymptotic fields near the crack tip are obtained in an explicit form and the intensity factors of temperature gradients are determined. Numerical results show that temperature overshooting phenomenon may occur due to the thermal disturbance of crack based on the dual-phase-lag model. The dual-phase-lag model parameters, the heat conductivity of the crack surfaces and the geometric size of the half-plane have significant influence on the dynamic temperature fields.
Keywords
Transient temperature field , Dual-phase-lag heat conduction model , Singular integral equations , Partially insulated crack
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Serial Year
2013
Journal title
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Record number
1078889
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