Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances

Surface modified SiO2 particles in an aqueous environment with γ-aminopropyl triethoxysilane (APTS)/methyl trimethoxysilane (MTMOS) are introduced as abrasive in the slurry. The modified silica particles are characterized by Particle Size/Zeta Potential Analysis, Fourier Transform Infrared Spectroscopy (FTIR), Thermal Gravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). In addition, the enhancement of polishing rate owning to the modified silicon particles in silicon wafer Chemical Mechanical Polishing (CMP) is observed.