The formation of electric circuits with carbon nanotubes and copper using tin solder Original Research Article

A Sn coated single multi-walled carbon nanotube (MWCNT) was connected between Cu terminals and with other MWCNTs using tin solder. HRTEM micrographs showed the interconnections between two sides as well as on one side of a Cu grid. MWCNTs not only formed straight connections but also bent in the middle with little damage to the graphenes of nanotubes. The process also joined a single nanotube with other nanotubes at their tips as well as in the middle, and in various modes including series and parallel. The connections were found to be stable in air and under TEM observations, and could be made by both small and large diameter MWCNTs. The process uses existing Sn-based soldering technology and provides a way for the development of CNT-based nanochips.