Title of article
Molecular phonon couplers at carbon nanotube/substrate interface to enhance interfacial thermal transport Original Research Article
Author/Authors
Wei Lin، نويسنده , , Rongwei Zhang، نويسنده , , Kyoung-sik Moon، نويسنده , , C.P. Wong، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2010
Pages
7
From page
107
To page
113
Abstract
A novel assembling process of incorporating carbon nanotubes as thermal interface materials for heat dissipation has been developed by synthesizing vertically aligned carbon nanotubes on a copper substrate and chemically bonding the carbon nanotubes to a
Journal title
Carbon
Serial Year
2010
Journal title
Carbon
Record number
1126430
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