Title of article
A model of migrating grain-boundary grooves with application to two mobility-measurement methods Original Research Article
Author/Authors
Donghong Min، نويسنده , , Harris Wong، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2002
Pages
15
From page
5155
To page
5169
Abstract
Grain-boundary migration controls grain growth and is important in materials processing and synthesis. The mobility of grain boundaries is usually measured by the “quarter-loop” and Sun–Bauer methods. In these methods, a grain boundary migrates and its tip position along a free surface is recorded to infer the mobility. At the tip, a groove develops to reduce the combined surface energy. The groove is small and adjusts quickly. Thus, in both methods, the groove can be treated at each instant as migrating at constant speed. We study this quasi-steady groove formed via surface diffusion, and find that the groove turns the grain boundary (by angle θ) away from being perpendicular to the free surface. We add this tilting effect into both measurement methods by solving the migrating grain-boundary profiles for arbitrary θ. Computed profiles agree well with two Sun–Bauer experiments in which θ=18 and 30°.
Keywords
Surface diffusion , Mobility , Grain growth , Grain-boundary migration , Thermal grooving
Journal title
ACTA Materialia
Serial Year
2002
Journal title
ACTA Materialia
Record number
1140120
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