Title of article :
Fracture behaviors of nanowire-coated metal/polymer systems under mode-I loading condition Original Research Article
Author/Authors :
Ho-Young Lee، نويسنده , , Yong Hyup Kim، نويسنده , , Young-Keun Chang، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2004
Pages :
14
From page :
5815
To page :
5828
Abstract :
In previous works, two kinds of nanowires were formed on the surface of a copper-based leadframe by immersing them in two kinds of hot alkaline solutions. The nanowire-coated copper-based leadframe sheets were molded with epoxy molding compound (EMC), and the molded bodies were machined to form sandwiched double-cantilever beam specimens to measure the fracture toughness of the nanowire-coated leadframe (metal)/EMC (polymer) interfaces under quasi-mode-I loading condition. After the adhesion test, the fracture surfaces were analyzed to clarify the failure path by using various equipments. The present work attempted to correlate the failure path to adhesion strength by using a simple adhesion model.
Keywords :
Polymer , Failure path , Nanostructure , Micromechanical modeling , Fiber reinforced composite , Copper alloys
Journal title :
ACTA Materialia
Serial Year :
2004
Journal title :
ACTA Materialia
Record number :
1141145
Link To Document :
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