• Title of article

    Fracture behaviors of nanowire-coated metal/polymer systems under mode-I loading condition Original Research Article

  • Author/Authors

    Ho-Young Lee، نويسنده , , Yong Hyup Kim، نويسنده , , Young-Keun Chang، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2004
  • Pages
    14
  • From page
    5815
  • To page
    5828
  • Abstract
    In previous works, two kinds of nanowires were formed on the surface of a copper-based leadframe by immersing them in two kinds of hot alkaline solutions. The nanowire-coated copper-based leadframe sheets were molded with epoxy molding compound (EMC), and the molded bodies were machined to form sandwiched double-cantilever beam specimens to measure the fracture toughness of the nanowire-coated leadframe (metal)/EMC (polymer) interfaces under quasi-mode-I loading condition. After the adhesion test, the fracture surfaces were analyzed to clarify the failure path by using various equipments. The present work attempted to correlate the failure path to adhesion strength by using a simple adhesion model.
  • Keywords
    Polymer , Failure path , Nanostructure , Micromechanical modeling , Fiber reinforced composite , Copper alloys
  • Journal title
    ACTA Materialia
  • Serial Year
    2004
  • Journal title
    ACTA Materialia
  • Record number

    1141145