Effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior of Cu with dispersed Fe particles Original Research Article

The effect of particle/matrix interfacial character on the high-temperature deformation and recrystallization behavior of Cu was systematically investigated at various temperatures from 723 to 973 K and at true strain rates between 4.1 × 10−4 and 3.2 × 10−2 s−1. Cu with dispersed coherent γ-Fe precipitates (Cu–γ-Fe alloy) displayed lower yield stresses and higher flow stresses than Cu containing incoherent α-Fe precipitates (Cu–α-Fe alloy) under all testing conditions. Dynamic recrystallization (DRX) took place more easily in the Cu–α-Fe alloy than in the Cu–γ-Fe alloy. Although DRX was strongly impeded by the presence of the coherent precipitates at low to medium strains, the recrystallized regions gradually spread, accompanied by transformation of the coherent precipitates into incoherent ones. Such a large difference in the deformation and DRX behaviors depending on the particle/matrix interfacial character is attributed to the stronger interaction between dislocations and the coherent particles.