Title of article :
Dihedral angles in Cu–1 wt.% Pb: Grain boundary energy and grain boundary triple line effects Original Research Article
Author/Authors :
D. Empl، نويسنده , , L. FELBERBAUM، نويسنده , , V. Laporte، نويسنده , , D. Chatain، نويسنده , , A. Mortensen، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2009
Pages :
11
From page :
2527
To page :
2537
Abstract :
The dihedral angle shown by intergranular lead inclusions in Cu–1 wt.% Pb alloys is measured varying the purity of the metal and the temperature. Several measurement methods are used and compared, namely classical two-dimensional (2D) methods based on metallurgical cross-section analysis and a recently developed 3D stereoscopic method that yields the true three-dimensional angle value for individual inclusions straddling a flat grain boundary. We confirm and extend earlier measurements using the new method. We show that a discrepancy found between the literature data and the stereoscopic 3D dihedral angle measurements is not caused by impurity effects. Rather, the data indicate that the discrepancy has its origin in a difference in average dihedral angle values measured between inclusions straddling two grains and values found at inclusions located where three or more grains meet.
Keywords :
Capillary phenomena , copper , Grain boundary energy , Grain boundary wetting , Triple junction
Journal title :
ACTA Materialia
Serial Year :
2009
Journal title :
ACTA Materialia
Record number :
1144238
Link To Document :
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