Title of article :
High-temperature strength of compacted sub-micrometer aluminium powder Original Research Article
Author/Authors :
C. Poletti، نويسنده , , M. Balog، نويسنده , , F. Simancik، نويسنده , , H.P. Degischer، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2010
Pages :
9
From page :
3781
To page :
3789
Abstract :
Aluminium powders with a mean particle size of around 1 μm were compacted by cold isostatic pressing (CIP) and additional forging. The specimens are characterized by hot compression tests, dilatometry and metallography. A 3D interconnected structure of alumina films <5 nm in thickness is observed by transmission electron microscopy and field emission gun scanning electron microscopy; it is associated with the natural oxide skin which covers every aluminium powder and occupies around 3 vol.%. The compression tests are carried out in the range of 350–520 °C at strain rates of 0.003–3 s−1. The compressive strength was 100–150 and 130–180 MPa for the CIPed and forged samples, respectively. The low strain rate sensitivity m (<0.08) suggests that the alumina network forms a barrier, which suppresses any restoration mechanism across the grain boundaries as well as grain boundary sliding during hot deformation. The high strength of such compacted sub-micron Al powder is attributed to the conservation of a 3D alumina closed cell network filled with elastoplastic aluminium.
Keywords :
Powder consolidation , Aluminium , High-temperature deformation , Grain boundary structure , Ultrafine-grained microstructure
Journal title :
ACTA Materialia
Serial Year :
2010
Journal title :
ACTA Materialia
Record number :
1144971
Link To Document :
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