Title of article
Measurement of grain boundary triple line energy in copper Original Research Article
Author/Authors
B. Zhao ، نويسنده , , J.Ch. Verhasselt، نويسنده , , L.S Shvindlerman، نويسنده , , G. Gottstein، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2010
Pages
8
From page
5646
To page
5653
Abstract
Recent studies have demonstrated that grain boundary triple junctions are crystal defects with specific thermodynamic and kinetic properties. In this study we address the energy of triple lines. Previously, a geometrical model was proposed to determine the grain boundary line tension. The current study introduces a thermodynamically correct approach which allows direct and precise measurement of the triple line energy. The experimental technique utilizes the measurement of the surface topography of a crystal in the vicinity of a triple junction by atomic force microscopy. The grain boundary triple line tension image of a random triple line in a copper tricrystal was measured to be 6.3 ± 2.8 × 10−9 J m–1.
Keywords
Grain boundary , Triple junction , Line tension of boundary triple junction
Journal title
ACTA Materialia
Serial Year
2010
Journal title
ACTA Materialia
Record number
1145148
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