Title of article
Microstructure evolution of Cu/Ag interface in the Cu–6 wt.% Ag filamentary nanocomposite Original Research Article
Author/Authors
J.B Liu، نويسنده , , L. Zhang، نويسنده , , D.W. Yao، نويسنده , , L. Meng، نويسنده ,
Issue Information
دوهفته نامه با شماره پیاپی سال 2011
Pages
7
From page
1191
To page
1197
Abstract
A Cu–6 wt.% Ag filamentary nanocomposite was prepared by melting, aging and cold drawing. The changes in phase morphology and interface behavior in the preparation process were investigated. The Ag precipitates evolve into filaments during drawing deformation. The interface changes into coherence from semi-coherence if the filament diameter decreases to ∼2.0 nm during drawing deformation. The evolution of semi-coherent interface into coherent interface is analyzed on the basis of the minimum energy principle.
Keywords
Deep drawing , Copper alloys , Deformation structure , Interface structure
Journal title
ACTA Materialia
Serial Year
2011
Journal title
ACTA Materialia
Record number
1145387
Link To Document