• Title of article

    Microstructure evolution of Cu/Ag interface in the Cu–6 wt.% Ag filamentary nanocomposite Original Research Article

  • Author/Authors

    J.B Liu، نويسنده , , L. Zhang، نويسنده , , D.W. Yao، نويسنده , , L. Meng، نويسنده ,

  • Issue Information
    دوهفته نامه با شماره پیاپی سال 2011
  • Pages
    7
  • From page
    1191
  • To page
    1197
  • Abstract
    A Cu–6 wt.% Ag filamentary nanocomposite was prepared by melting, aging and cold drawing. The changes in phase morphology and interface behavior in the preparation process were investigated. The Ag precipitates evolve into filaments during drawing deformation. The interface changes into coherence from semi-coherence if the filament diameter decreases to ∼2.0 nm during drawing deformation. The evolution of semi-coherent interface into coherent interface is analyzed on the basis of the minimum energy principle.
  • Keywords
    Deep drawing , Copper alloys , Deformation structure , Interface structure
  • Journal title
    ACTA Materialia
  • Serial Year
    2011
  • Journal title
    ACTA Materialia
  • Record number

    1145387