Title of article :
Microstructure evolution of Cu/Ag interface in the Cu–6 wt.% Ag filamentary nanocomposite Original Research Article
Author/Authors :
J.B Liu، نويسنده , , L. Zhang، نويسنده , , D.W. Yao، نويسنده , , L. Meng، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2011
Abstract :
A Cu–6 wt.% Ag filamentary nanocomposite was prepared by melting, aging and cold drawing. The changes in phase morphology and interface behavior in the preparation process were investigated. The Ag precipitates evolve into filaments during drawing deformation. The interface changes into coherence from semi-coherence if the filament diameter decreases to ∼2.0 nm during drawing deformation. The evolution of semi-coherent interface into coherent interface is analyzed on the basis of the minimum energy principle.
Keywords :
Deep drawing , Copper alloys , Deformation structure , Interface structure
Journal title :
ACTA Materialia
Journal title :
ACTA Materialia