Title of article :
Strain mapping near a triple junction in strained Ni-based alloy using EBSD and biaxial nanogauges Original Research Article
Author/Authors :
T. A. Clair، نويسنده , , M. Foucault، نويسنده , , O. Calonne، نويسنده , , Y. Lacroute، نويسنده , , L. Markey، نويسنده , , M. Salazar، نويسنده , , V. Vignal، نويسنده , , E. Finot، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2011
Pages :
8
From page :
3116
To page :
3123
Abstract :
A key element for analyzing the crack initiation in strained polycrystalline alloys is the local quantification of the surface strain distribution according to the grain texture. Using electron backscattered diffraction, the local microstructure was determined to both localize a triple junction and deduce the local Schmid factors. Kernel average misorientation (KAM) was also used to map the areas of defect concentration. The maximum principal strain and the in-plane shear strain were quantified using the biaxial nanogauge. Distortions of the array of nanodots used as spot markers were analyzed near the triple junction. The crystallographic orientation and the surface strain were then investigated both statistically for each grain and locally at the grain boundaries. The superimposition of microstructure and strain maps allows the high strain gradient (reaching 3-fold the applied strain) to be localized at preferential grain boundaries near the triple junction. The Schmid factors and the KAM were compared to the maximum principal strain and the in-plane shear strain respectively. The polycrystalline deformation was attributable first to the rotation of some grains, followed by the elongation of all grains along their preferential activated slip systems.
Keywords :
EBSD , Texture , gauge , Lithography , Tensile strength
Journal title :
ACTA Materialia
Serial Year :
2011
Journal title :
ACTA Materialia
Record number :
1145575
Link To Document :
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