Title of article :
Thermal stability and strength of deformation microstructures in pure copper Original Research Article
Author/Authors :
C. Saldana، نويسنده , , A.H King، نويسنده , , S. Chandrasekar، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2012
Pages :
10
From page :
4107
To page :
4116
Abstract :
The plastic flow field produced by machining is utilized to access a range of deformation parameters in pure copper: strains of 1–7, strain rates of 1–1000 s−1 and temperatures as low as 77 K. The strength and stability of the severe plastic deformation microstructures including cellular, elongated, equiaxed and twinned types are characterized. Unique combinations of strengthening and stability are identified in the case of heavily twinned microstructures. These observations offer insights for improving the stability of both single-phase and multicomponent ultrafine-grained alloys.
Keywords :
Ultrafine-grained (UFG) microstructure , Deformation twinning , Nanocrystalline Cu , Severe plastic deformation
Journal title :
ACTA Materialia
Serial Year :
2012
Journal title :
ACTA Materialia
Record number :
1146399
Link To Document :
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