Title of article :
Coagulation process of soymilk characterized by electrical impedance spectroscopy Original Research Article
Author/Authors :
Xingshu Li، نويسنده , , Kiyohiko Toyoda، نويسنده , , Ikko Ihara، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2011
Pages :
6
From page :
563
To page :
568
Abstract :
Soymilk coagulation process is the most important step in tofu making. An experimental setup was developed to control the coagulation temperature and heating rate by ohmic heating and to perform impedance measurement in time-sharing mode. Soymilk coagulation process was characterized by electrical impedance spectroscopy. Frequency 10 kHz was chosen to analyze the coagulation process. Normalized conductivity was useful in determination of the endpoint of soymilk coagulation process. The coagulation process was considered as two successive first-order reactions. The rate constant in the first stage was 10 times higher than that in the second stage, both rate constants increased with coagulation temperature. The activation energy in the second stage was three times greater than that in the first stage. The successive reaction process was elucidated by using soymilk coagulation mechanism. The use of impedance measurement to analyze the coagulation process provides a basis for the control of soymilk coagulation process.
Keywords :
Soymilk , Coagulation process , Electrical impedance spectroscopy , Ohmic heating , Conductivity
Journal title :
Journal of Food Engineering
Serial Year :
2011
Journal title :
Journal of Food Engineering
Record number :
1169151
Link To Document :
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