Thermal contact resistance of different materials between 0.3 K and 4.5 K

The choice of a good bonding agent often depends on the temperature range of use and on its corresponding thermal contact resistance. Measurements obtained between 0.3 K and 4.5 K were made applying the steady state heat flow method across the interfaces of small crystals of quartz (SiO2) sandwiched by two copper blocks and attached with various types of contact materials. Below 1 K, we found that for one crystal attached with indium solder its thermal contact resistance was image image. This value in comparison with those attached with a conductive and an insulating epoxies, turns to be the lowest.