Performance of powder filled resin-bonded diamond wheels in the vertical dry grinding of tungsten carbide

Grinding performances of several resin-bonded diamond wheels containing copper, silicon carbide and carbon black fillers in the vertical dry grinding of cemented tungsten carbide are studied. The experimental results showed that the resin-bonded diamond wheel with the greatest amount of copper filler resulted in a relatively higher proportion of protrusive particles and partial breakage grits and a smaller number of pull-out holes occurred on the bond surface, which leads the wheel to produce relatively higher grinding forces and temperatures. The resulting grinding ratio is relatively low. The grinding forces and temperatures produced for the wheel containing silicon carbide and copper filler increase with the increase of the proportion of silicon carbide filler. Small amounts of carbon black filler added into the wheel containing copper filler can obtain the positive effect with the decrease of the grinding forces and the wheel wear. However, the grinding temperature produced during the dry grinding is still relatively high. Low grinding ratio produced in the vertical dry grinding is mainly attributed to high temperature and the grinding mechanism.