State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

This research has successfully developed an advanced manufacturing system for φ300 mm silicon wafer, using fixed abrasive instead of conventional free slurry, to provide a totally integrated solution for achieving a surface roughness of Ra<1 nm (Ry<5–6 nm) and a global flatness of <0.2 μm/φ300 mm. In addition to a high throughput rate, this system significantly reduces the total energy consumption by 70%, compared with the current process used for φ200 mm Si wafer. This paper describes the principle of material removal, state-of-the-art technologies and kinematical analysis for the one-stop finishing of φ300 mm Si wafer by fixed abrasive process.