• Title of article

    Development of optimal layout design system in multihole blanking process

  • Author/Authors

    Seon-Bong Lee، نويسنده , , Dong-Hwan Kim، نويسنده , , Byung-Min Kim، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2002
  • Pages
    7
  • From page
    2
  • To page
    8
  • Abstract
    In order to produce precision integrated circuit (IC) leadframe, it must be done through try-error. IC leadframe needs the precision shape for good efficiency. The blanking of sheet metal using progressive dies is an important process on production of precision electronic machine parts. Especially, the main defect is lead shift of inner leads in progressive blanking process. In this paper, FE simulation technique has been proposed to predict the deformation behavior and springback of IC leadframe through the simulation of the progressive blanking process. It predicts the shape of the stamped component after forming, trimming and springback for inner leads. The next blanking process is executed repeatedly until the final blanking of lead. From the results of FE analysis using suggested method in this research, it is possible to predict the lead shift of leadframe to manufacture high precision leadframe in progressive blanking process and these results might be used as a guideline to optimize layout design system in multihole blanking process.
  • Keywords
    Blanking process , Lead shift , IC leadframe , Progressive dies
  • Journal title
    Journal of Materials Processing Technology
  • Serial Year
    2002
  • Journal title
    Journal of Materials Processing Technology
  • Record number

    1177145