Titanium nitride coatings on copper alloy prepared by dc reactive magnetron sputtering

The theory of deposition of TiN by dc magnetron sputtering for wear protection of the surfaces is well known using different ferrous substrates. This theory apparently, is not so true for other non-ferrous materials. The present work shows the study of some characteristics of TiN deposition on a ternary copper alloy (Cu–3% Ti–1% Cr) with the purpose of modifying their superficial properties, and in this way allowing to enlarge the alternatives of use of this alloy. The wear, microhardness and adhesion of the films deposited have been studied under different conditions of applied current, Ar/N2 flow ratio and bias voltage by means of dc planar magnetron sputtering.By this study we concluded that, unlike the case of steel, for increasing the wear resistance of the alloy it is advisable not to use bias voltage during TiN deposition. It is desirable to obtain an open columnar structure in order to increase the wear resistance and the critical load in scratch testing.