Effect of lamination conditions on sintered properties of glass-ceramic substrates for microelectronic packaging

This work is a quantitative evaluation of the effect of lamination variables on sintering shrinkage and properties of glass-ceramic substrates for microelectronic packaging. Dielectric properties and thermophysical properties of laminated and sintered substrates were measured to compare the effects of lamination parameters. Material characterization such as scanning electron microscope (SEM) and X-ray analysis were carried out to identify the morphology and crystal structure of the sintered substrates. Different lamination conditions were observed to strongly affect the densities of laminates which show different compactness and porosity in the laminated structures. Among the sintered properties that were measured, firing shrinkage is the main factor affected by the lamination conditions. Dielectric constants of sintered substrates slightly increase with the sintered density. However, as the laminates undergo a complete sintering process, microstructures, crystallinity, and CTE of the sintered substrates were scarcely influenced by the lamination stage.