The development of a tri-material system and appropriate bonding parameters for the thermal bonding of flat leads

The aim of this paper is to detail the research and experimental work carried out on thermal bonding as a solder alternative. This novel technique incorporates current electronic processes to pressure bond component leads to PCB pads. This paper will outline an effective tri-material system designed to overcome problems such as pad deformation and poor conduction during compression bonding. It details the adhesion and environmental tests used in the examining both the plating and bonding process. The tri-material system is comprised of a flat copper lead on which tin and nickel are electroplated. The paper also introduces the development of a finite element model designed to illustrate the temperature flow and stress distribution throughout the joint.