• Title of article

    Finite element analysis of thermal shock tests of RF connectors

  • Author/Authors

    Z.Y. Zhu، نويسنده , , H.P. Lee، نويسنده , , B.T. Cheok، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2005
  • Pages
    5
  • From page
    291
  • To page
    295
  • Abstract
    Digital or virtual testing of prototypes is frequently carried out in product design and testing for reducing the time as well as the cost of product development. An example on the thermal shock test of a radio frequency (RF) connector is presented. The thermal shock test of the RF connector is analyzed using the finite element method. The initial temperature condition of terminal and pin is assumed to be the room temperature (25 °C), and a cyclic temperature variation from −65 to 165 °C with a frequency of four cycles per hour is applied on the outer surfaces, similar to the thermal shock test under standard MIL-STD-883 test condition. The RF connector is found to work properly under these thermal shock loadings.
  • Keywords
    Thermal shock , Finite element analysis , Virtual testing , RF connector
  • Journal title
    Journal of Materials Processing Technology
  • Serial Year
    2005
  • Journal title
    Journal of Materials Processing Technology
  • Record number

    1179666