Deformation analysis of Au wire bonding

In wire bonding, the shape of the capillary that presses the Au ball, the thickness and the deformation resistance of the Al deposited film are important factors for stable bonding. In order to evaluate the optimal bonding conditions, deformation analysis of Au ball and Al deposited film with a thickness of 2 μm was carried out. The results of the deformation analysis of the Au ball and Al deposited film indicated that deformation patterns were evaluated closely to the actual deformation patterns. The deformation resistance and the thickness of the deposited film had a significant influence on the deformation of the Au ball. The deposited film functioned as a solid lubricant at the bonding surface. The evaluation method used in this study was effective for determining the optimum conditions of deposited film and the processing temperature.