Title of article
The evaluation of residual stress on the drawn wire using nano-indentation test
Author/Authors
D.C. Ko، نويسنده , , Ivan S.K. Lee، نويسنده , , W.H. Hwangb، نويسنده , , B.M. Kim، نويسنده , , C.M. Bae، نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 2007
Pages
4
From page
64
To page
67
Abstract
The residual stresses produced after wire drawing process have a harmful effect on the durability of the wire and become the cause which decreases the quality of the drawn wire. In this study, the influence of process parameters in the drawn wire on the residual stress was investigated by FE analysis. Based on the result of FE analysis, a residual stress relaxation method was suggested. The effectiveness of the suggested method was verified by the drawing experiment and the residual stress measurement through nano-indentation test.
Keywords
Nano-indentation test , Residual stress , FE analysis , Residual stress relaxation method
Journal title
Journal of Materials Processing Technology
Serial Year
2007
Journal title
Journal of Materials Processing Technology
Record number
1181140
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