The influence of different cutting speeds on the cutting force and strain–stress behaviors of single crystal copper during nano-scale orthogonal cutting

This paper uses a method that combines molecular dynamics with finite element deformation model (MDFM) to calculate the stress and strain of single crystal copper that occur during nano-scale orthogonal cutting. Using the MDFM model, the phenomenon of residual strain, residual stress on the machined surface and the cutting force by the four different cutting speeds such as 20, 50, 100 and 200 m/s were investigated during nano-scale orthogonal cutting. The average cutting force is about the same under different cutting speeds ranging from 20 to 200 m/s during steady cutting state. This paper also finds that it has only minor influence for the different cutting speeds on the distribution of the strain and stress at the contact area between the cutting chip and rigid tool during steady cutting state. And the cutting speed has greater influence on the distribution of strain and stress in the shear zone. The distribution of strain and stress in shear zone increases when the cutting speed decreases. Under different cutting speeds, the values and distribution ranges of the residual strain and residual stress on the machined surface of single crystal copper are similar.