Title of article :
Initial bond formation in thermosonic gold ball bonding on aluminium metallization pads
Author/Authors :
Hui Xu، نويسنده , , Changqing Liu، نويسنده , , VADIM V. SILBERSCHMIDT، نويسنده , , Zhong Chen، نويسنده , , Jun Wei، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2010
Pages :
8
From page :
1035
To page :
1042
Abstract :
The morphological features of lift-off footprints on the aluminium metallization pads were investigated to gain an understanding of the effects of bonding parameters on formation of initial bonds during thermosonic gold ball bonding. The obtained results showed that metallurgical bonding initiated at the peripheral areas of the contact area situated along the direction of ultrasonic vibration. Those areas extended inwards with an increase in ultrasonic power. Both the external bonded area and central non-bonded area increased with increasing bonding force. Based on the evolution of footprints, the bonding models were proposed, and the effects of the bonding parameters on the formation of initial bonds were discussed.
Keywords :
Ultrasonic power , Bonding force , Bonding mechanism , Gold ball bonding , Lift-off footprint
Journal title :
Journal of Materials Processing Technology
Serial Year :
2010
Journal title :
Journal of Materials Processing Technology
Record number :
1183873
Link To Document :
بازگشت