Controlling Al/Cu composite diffusion layer during hydrostatic extrusion by using colloidal Ag

In this study, intermetallic compound formation at the interface between aluminum and copper during hydrostatic extrusion was simulated by performing a solid state diffusion bonding experiment with various processing parameters, including bonding temperature and pressure and holding time, and by inserting an Ag colloid layer between the aluminum and copper. Regression equations were developed to predict thickness of diffusion layer and interface hardness. An intermetallic compound formed at the interface between the Al and Cu during diffusion bonding at 420 °C and 240 MPa for 60 min, and it was effectively controlled by inserting an Ag colloid. These experimental data will be useful for setting up processing parameters to prepare Al/Cu matrix composite materials by using hydrostatic extrusion.