Title of article :
The cure behavior of tetraglycidyl diaminodiphenyl methane with diaminodiphenyl sulfone
Author/Authors :
Gao Jiawu، نويسنده , , Shen Kui، نويسنده , , Gao Zong Mong، نويسنده ,
Issue Information :
دوهفته نامه با شماره پیاپی سال 2000
Abstract :
It is well known that the preparation of an high-performance composite product depends not only on raw materials (resin and fiber) but also on the curing technological condition, or rather, the determination of the curing technological parameters. In this study torsional braid analysis (TBA) is used to study the cure behavior of tetraglycidyl diaminodiphenyl methane (TGDDM or Ag-80) with diaminodiphenyl sulfone (DDS), providing theoretical data for determining the curing condition of this resin matrix composites. Isothermal TBA technique is used to obtain a time–temperature-transformation (TTT) cure diagram, according to which the three different types of cure behavior are discussed. The data for Tg for different cure temperatures and times provide and estimation of the time to full cure vs. isothermal cure temperature for the resin system. An empirical Tg–Tc–time (TTT) equation is also developed.
Keywords :
Cure behavior , TBA , Epoxy resin , TTT diagram , TTT equation
Journal title :
Thermochimica Acta
Journal title :
Thermochimica Acta