مرکز منطقه ای اطلاع رساني علوم و فناوري - THREE-DIMENSIONAL SIMULATION OF FLIP CHIP ENCAPSULATION PROCESS

Title of article :

THREE-DIMENSIONAL SIMULATION OF FLIP CHIP ENCAPSULATION PROCESS

Author/Authors :

Y.K. Shen، نويسنده , , H.C. Lee & E.M. Baggs، نويسنده ,

Issue Information :

روزنامه با شماره پیاپی سال 2002

Pages :

From page :

961

To page :

970

Journal title :

International Communications in Heat and Mass Transfer

Serial Year :

2002

Journal title :

International Communications in Heat and Mass Transfer

Record number :

1219647

Link To Document :