Electrostatic force acting on conductive ball between electrodes II: Cylindrical upper electrode with hemispherical tip for capturing/releasing conductive ball

The electrostatic force between a conductive ball on a plane electrode and a cylindrical electrode with a hemispherical tip is analyzed. A cylindrical electrode with a dielectric film for realizing a new LSI bonding system is proposed. The force on the ball increases with increasing diameter of the cylindrical electrode. When a dielectric film is placed under the cylindrical upper electrode with a fixed gap between the electrodes, the force acting on the ball increases with increasing dielectric film thickness. Capture of the ball was experimentally confirmed. This study provides a useful foundation for electrostatic manipulation of a conductive ball.