Optimization methodology for electrospray evaporative cooling chambers

Electrospray evaporative cooling (ESEC) has been investigated as the potential thermal management solution for future electronics. However, the optimal heat transfer performance of ESEC chambers has not yet been thoroughly examined. This paper investigates optimal heat transfer performance of ESEC chambers with different geometry types. The geometry types affect the ESEC chambersʹ heat transfer performance in different ways. Although increasing the quantity of the micronozzles and the spacing between them does not improve the steady state heat transfer performance, a higher quantity of micronozzles with increased spacing noticeably enhances the transient cooling rate. Additionally, certain practical design issues are discussed.