• Title of article

    Solvent debinding mechanism for alumina injection molded compacts with water-soluble binders

  • Author/Authors

    Wei-Wen Yang، نويسنده , , Kai-Yuan Yang، نويسنده , , Moo-Chin Wang، نويسنده , , Min Hsiung Hon، نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 2003
  • Pages
    12
  • From page
    745
  • To page
    756
  • Abstract
    The solvent debinding process has been widely accepted in the ceramic injection molding (CIM) industry process due to its short debinding cycle. However, the organic solvents most adopted in solvent debinding now are flammable, carcinogenic and not environmentally acceptable. For eliminating the use of unsound solvents, water-soluble polyethylene glycol (PEG) is used in this study to modify the pattern of debinding in CIM. The purpose of the investigation was to examine the binder behavior during solvent debinding based on water extraction for a multi-component PEG binder system. Based on the in situ evaluation results of dimensional variations, mercury intrusion data and scanning electron microscope (SEM) observations, possible solvent debinding mechanism for alumina injection molded compacts with water-soluble binders is proposed.
  • Keywords
    Solvent debinding , A. Injection molding , B. Porosity , D. Al2O3
  • Journal title
    Ceramics International
  • Serial Year
    2003
  • Journal title
    Ceramics International
  • Record number

    1268624