Title of article :
Solvent debinding mechanism for alumina injection molded compacts with water-soluble binders
Author/Authors :
Wei-Wen Yang، نويسنده , , Kai-Yuan Yang، نويسنده , , Moo-Chin Wang، نويسنده , , Min Hsiung Hon، نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 2003
Pages :
12
From page :
745
To page :
756
Abstract :
The solvent debinding process has been widely accepted in the ceramic injection molding (CIM) industry process due to its short debinding cycle. However, the organic solvents most adopted in solvent debinding now are flammable, carcinogenic and not environmentally acceptable. For eliminating the use of unsound solvents, water-soluble polyethylene glycol (PEG) is used in this study to modify the pattern of debinding in CIM. The purpose of the investigation was to examine the binder behavior during solvent debinding based on water extraction for a multi-component PEG binder system. Based on the in situ evaluation results of dimensional variations, mercury intrusion data and scanning electron microscope (SEM) observations, possible solvent debinding mechanism for alumina injection molded compacts with water-soluble binders is proposed.
Keywords :
Solvent debinding , A. Injection molding , B. Porosity , D. Al2O3
Journal title :
Ceramics International
Serial Year :
2003
Journal title :
Ceramics International
Record number :
1268624
Link To Document :
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