The growth of interfacial compounds between titanium dioxide and bismuth oxide

The growth of interfacial compounds between TiO2 and Bi2O3 during transient liquid phase bonding at 900, 1000 and 1100 °C for various times was investigated. The microstructures and compositions of compounds in joints were analyzed by means of SEM and EPMA. It was found that the compound Bi4Ti3O12 forms initially and replaces the Bi2O3 interlayer. Bi2Ti4O11 then arises at the interface between Bi4Ti3O12 and TiO2 and the metastable Bi2Ti2O7 phase appears last at the interface between Bi4Ti3O12 and Bi2Ti4O11. The modes and activation energies of the growth of Bi4Ti3O12 and Bi2Ti4O11 were determined respectively. Holes in the middle of the joint heated at 1100 °C for 24 h were also found.