Adhesion behavior between yttrium-stabilized zirconia added La0.8Ca0.2Cr0.9Co0.1O3−δ interconnector and yttrium-stabilized zirconia-based substrate

Because of the different densification characteristics of a La0.8Ca0.2Cr0.9Co0.1O3-δ (LCCC) interconnector and a NiO added yttrium-stabilized zirconia (YSZ) anode, complete adhesion between the two layers is hardly obtainable. In this study, we have investigated the sintering behavior of LCCC with the addition of YSZ. As the amount of YSZ increases, densification of the LCCC is inhibited and the initial temperature of the densification increases. However, when the LCCC–YSZ composite layer is screen printed on the NiO–YSZ substrates, the density of the composite layer increases and the layer is firmly attached to the substrates. It is proposed that tensile stress is decreased on the composite layer due to the relatively delayed densification of the LCCC–YSZ composite, compared to the densification of the NiO–YSZ substrate.