Title of article :
Measurement and modeling of the annealing kinetics of stress induced leakage current in ultra-thin oxides
Author/Authors :
Ghibaudo، G. نويسنده , , Pananakakis، G. نويسنده , , Riess، P. نويسنده , , Brini، J. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
-202
From page :
203
To page :
0
Abstract :
The annealing properties of the stress induced leakage current (SILC) for 55 and 65 A thick oxides are investigated. It is demonstrated that the SILC is a fully reversible degradation process and that its generation kinetics are nearly unchanged after successive stressing/annealing cycles. The activation energy and diffusion coefficient of the annealing process has been extracted and shown to be independent of oxide thickness. Moreover the annealing kinetics are quantitatively simulated using a drift-diffusion model with the experimentally extracted parameters.
Keywords :
Thermal benchmark IC , Measuring of thermal coupling in ICs , Dynamic thermal modeling of IC packages
Journal title :
MICROELECTRONICS RELIABILITY
Serial Year :
1999
Journal title :
MICROELECTRONICS RELIABILITY
Record number :
12872
Link To Document :
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