• Title of article

    Chip Scale Package (CSP) solder joint reliability and modeling

  • Author/Authors

    Amagai، M. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -462
  • From page
    463
  • To page
    0
  • Abstract
    This paper reports the surface electronic structure of light-emitting porous polycrystalline silicon (PPS) using Xray photoelectron spectroscopy (XPS). We find that the PPS films with strong photoluminescence (PL) effect can only be observed in thin film with trace amount of silicon nanoclusters and the luminescence can be enhanced remarkably with proper passivation of the PPS surface. Incomplete oxidation of silicon (Si^3+ or Si^2+) does not lead to visible PL. We further estimate that the average size of silicon nanoclusters is in the range of 20-30 A in the sample having PL emission. (C) 1999 Elsevicr Science Ltd. All rights reserved.
  • Keywords
    Solder fatique , Creep , Viscoplasticity , Extrapolation , Chip Scale Package , Finite element method , Viscoelasticily
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    12937