Title of article
Chip Scale Package (CSP) solder joint reliability and modeling
Author/Authors
Amagai، M. نويسنده ,
Issue Information
روزنامه با شماره پیاپی سال 1999
Pages
-462
From page
463
To page
0
Abstract
This paper reports the surface electronic structure of light-emitting porous polycrystalline silicon (PPS) using Xray photoelectron spectroscopy (XPS). We find that the PPS films with strong photoluminescence (PL) effect can only be observed in thin film with trace amount of silicon nanoclusters and the luminescence can be enhanced remarkably with proper passivation of the PPS surface. Incomplete oxidation of silicon (Si^3+ or Si^2+) does not lead to visible PL. We further estimate that the average size of silicon nanoclusters is in the range of 20-30 A in the sample having PL emission. (C) 1999 Elsevicr Science Ltd. All rights reserved.
Keywords
Solder fatique , Creep , Viscoplasticity , Extrapolation , Chip Scale Package , Finite element method , Viscoelasticily
Journal title
MICROELECTRONICS RELIABILITY
Serial Year
1999
Journal title
MICROELECTRONICS RELIABILITY
Record number
12937
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