Title of article :
Chip Scale Package (CSP) solder joint reliability and modeling
Author/Authors :
Amagai، M. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
This paper reports the surface electronic structure of light-emitting porous polycrystalline silicon (PPS) using Xray photoelectron spectroscopy (XPS). We find that the PPS films with strong photoluminescence (PL) effect can only be observed in thin film with trace amount of silicon nanoclusters and the luminescence can be enhanced remarkably with proper passivation of the PPS surface. Incomplete oxidation of silicon (Si^3+ or Si^2+) does not lead to visible PL. We further estimate that the average size of silicon nanoclusters is in the range of 20-30 A in the sample having PL emission. (C) 1999 Elsevicr Science Ltd. All rights reserved.
Keywords :
Chip Scale Package , Creep , Viscoplasticity , Viscoelasticily , Solder fatique , Finite element method , Extrapolation
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY