Title of article :
Accelerated dielectric breakdown and wear out standard testing methods and structures for reliability evaluation of thin oxides
Author/Authors :
Vincent، E. نويسنده , , Ghibaudo، G. نويسنده , , Pananakakis، G. نويسنده , , Kies، R. نويسنده , , Papadas، C. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
This paper describes the various methods used for the assessment of the breakdown and wear out properties of thin oxides currently employed in CMOS and EEPROM technologies. Standard procedures for breakdown and wear out testing are given in conjunction with the associated test structures required for their accomplishment. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Microstructural analysis , Resistance measurements , Aluminum alloys , Electromigration
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY