Author/Authors :
Kervarrec، G نويسنده , , Monfort، ML نويسنده , , Riaudel، A نويسنده , , Klimonda، PY نويسنده , , Coudrin، JR نويسنده , , Le، D نويسنده , , Razavet، نويسنده , , Boulaire، JY نويسنده , , Jeanpierre، P نويسنده , , Perie، D نويسنده , , Meister، R نويسنده , , Casassa، S نويسنده , , Haumon، JL نويسنده , , Liagre، B نويسنده ,
Abstract :
This paper makes a review of integrated circuit field failures on three types of environment respectively, Ground Benign (GB), Ground Fixed (Gf), and Airborne Inhabited Cargo (Aic). It appears that for permanent working GB, there was no package related failures and 2/3 of the failures had EOS origin. For Gf and A;c most of the failures were open balls bonds and open solder joints. A universal predicting reliability model is therefore proposed for the die part and for the package part. This study has been carried out in the frame of a working group, to update the French standard UTEC 80810 (ex RDF93 from CNET), and is an alternative guide to the obsolete MIL-HDBK217F for predicting reliability calculations. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Aluminum alloys , Microstructural analysis , Resistance measurements , Electromigration
