Title of article :
Study of Stress Induced Leakage Current by using high resolution measurements
Author/Authors :
Salvo، B. De نويسنده , , Ghibaudo، G. نويسنده , , Pananakakis، G. نويسنده , , Guillaumot، B. نويسنده , , Reimbold، G نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Pages :
-796
From page :
797
To page :
0
Abstract :
A thorough characterization of stress-induced leakage currents (SILCs) for a l 0nm-thick oxide, by using the floating-gate technique, is presented. The obtained current is modeled by a volume-limited conduction mechanism. Experimental and model suggest that SILC conduction mechanism is the same in thin as well as in thick oxides. © 1999 Published by Elsevier Science Ltd. All rights reserved.
Keywords :
Microstructural analysis , Resistance measurements , Aluminum alloys , Electromigration
Journal title :
MICROELECTRONICS RELIABILITY
Serial Year :
1999
Journal title :
MICROELECTRONICS RELIABILITY
Record number :
13003
Link To Document :
بازگشت