• Title of article

    Temperature Acceleration of Breakdown and Quasi-Breakdown Phenomena in Ultra-thin Oxides

  • Author/Authors

    Roy، D. M. نويسنده , , Vincent، E. نويسنده , , Ghibaudo، G. نويسنده , , Bruyere، S. نويسنده ,

  • Issue Information
    روزنامه با شماره پیاپی سال 1999
  • Pages
    -814
  • From page
    815
  • To page
    0
  • Abstract
    A study of the electric field and temperature dependence of the breakdown and quasi-breakdown phenomena is presented for 3.5 nm ultra-thin SiO2 gate oxides. Using a methodology based on the competing mecanism concept between breakdown and quasi-breakdown processes, quasi-breakdown activation energy as well as acceleration factor are determined. It is demonstrated on these 3.5nm gate oxides that the quasi-breakdown temperature activation energy is almost temperature independent on the contrary to the breakdown one. Moreover, it has been shown that the temperature dependence of the breakdown acceleration factor and the electric field dependence of the temperature activation energy cannot be explained by a pure "E" and "l/E" models, but can be interpreted by the "E" model if at least two types of molecular defect states are considered. © 1999 Elsevier Science Ltd. All rights reserved.
  • Keywords
    Microstructural analysis , Aluminum alloys , Resistance measurements , Electromigration
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Serial Year
    1999
  • Journal title
    MICROELECTRONICS RELIABILITY
  • Record number

    13009