Title of article :
Extended SPICE-like model accounting for layout effects on snapback phenomenon during ESD events.
Author/Authors :
Mortini، P. نويسنده , , Salome، P. نويسنده , , Richier، C. نويسنده , , Essaifi، S. نويسنده , , Zaza، I. نويسنده , , Juge، A. نويسنده , , LEROUX، C. نويسنده ,
Issue Information :
روزنامه با شماره پیاپی سال 1999
Abstract :
An extended SPICE-like model for snapback phenomenon including the impact of gate length and substrate on the holding voltage is presented. Substrate conduction is analytically solved thanks to a transmission line model. A fast extraction methodology is also described. This model is in good agreement with the measurements performed on deeply submicron CMOS technologies. © 1999 Elsevier Science Ltd. All rights reserved.
Keywords :
Resistance measurements , Aluminum alloys , Microstructural analysis , Electromigration
Journal title :
MICROELECTRONICS RELIABILITY
Journal title :
MICROELECTRONICS RELIABILITY
